This technology is appropriate for single and dual magnetron applications and synchronized pulsed bias. It allows higher process rates for metallic and reactive sputtering applications. Processes, such as Co-Sputtering with different target materials using dual magnetron systems and asymmetric bipolar pulse modes are possible. Applicable HPPMS / HiPIMS Pulse packages with superimposed DC or MF sputtering open new fields of applications.
Application HiPIMS + DC | Application HiPIMS + MF